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   晶片失效分析 →
Decapsulation
SEM&EDX
Probe Station Application
EMMI Application
OBIRCH Application
LC Application
IC Grinding:Positioned/None-positioned
De-Gold Bump
X-Ray Application
SAM Application
LC液晶熱點偵測
LC Application

利用液晶感測到IC漏電處分子排列重組,在顯微鏡下呈現出不同於其他區域的斑狀影像, 找尋在實際分析中困擾設計人員

的漏電區域(超過10mA之故障點)。LC可偵測因ESD,EOS應力破壞導致晶片失效的具體位置。

(請參閱EMMI, OBIRCH 相關內容)

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    LC / EMMI / OBIRCH 对比
    灵敏度 背面观察 现象
  LC 毫安级别 No No Hot Spots
  EMMI 微安级别 No Light Emission
  OBIRCH 微安级别 Yes Thermo-electric Property
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