| Services |
Description |
Note |
Unit |
Decapsulation |
Common Package Types |
All package types except special types |
Pcs |
Special Package Types
|
BGA, COB, Ceramic/Metal/Glass Package, Multi-chip-modules, Flip Chip, and other special packages |
Pcs |
SEM/EDX |
SEM Application |
SEM: Scanning Electron Microscop |
Hr |
| EDX Application |
EDX: Energy Dispersive X-ray |
Hr |
| Probe Station Application |
Probing Test |
|
Hr |
| Laser Cutting |
|
Hr |
| Common Leakage Analysis Tools |
EMMI Application |
EMMI: Emission Microscope |
Hr |
| OBIRCH Application |
Optical Beam Induced Resistance Change |
Hr |
| LC Hot Spot Detection |
. |
Pcs |
| IC Grinding |
Positioned |
. |
Pcs |
Non-Positioned |
. |
Pcs |
| De-Gold Bump |
De-gold bump |
Removing gold bumps |
Pcs |
| Nondestructive Detection |
X-Ray |
. |
Hr |
| SAM |
SAM: Scanning Acoustic Microscopy |
Hr |
| Engineering Service |
Engineering Service |
customer-specific engineering requirements |
Pcs-time |
