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Decapsulation
IC Decapsulation

Advances in plastic packaging are resulting in complex packages with increasingly high interconnect densities,

and in increasingly stringent requirements for package opening. The encapsulant must be removed clearly while

the integrity of the die, bond pads, bond wires and leadframe interconnects must be preserved.

Decapsulation Range: * Common Packages

* COB、BGA

* Ceramic / Metal / Glass Package, Multi-chip-module, Flip Chip, and other special    packages

 

 

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